uMCP

Micron this week has announced that it has started sampling the industry’s first multichip package (MCP) that integrates LPDDR5-6400 DRAM and 96-layer 3D NAND flash memory. The uMCP5 device is aimed at midrange 5G smartphones that require fast DRAM as well as high-performance storage. Micron’s uMCP5 device packs 12 GB of LPDDR5-6400 memory in a dual-channel arrangement, 256 GB of 96-layer 3D TLC NAND storage with a UFS interface, as well as an onboard controller. The LPDDR5 dies are made on the company's 2nd Generation 10nm process technology, while the company hasn't commented on the NAND. Combined, the complete uMCP5 chip uses a 297-pin standard BGA package. Overall, uMCP packages that integrate both DRAM and 3D NAND enable smartphone manufacturers to reduce the footprint that is...