More EPYC Servers: Dell Launches 1P and 2P PowerEdge for HPC and Virtualization
One of the many questions about AMD’s EPYC processor line related to AMD’s ability to reengage with OEMs since the Bulldozer era. Recent announcements from Microsoft Azure and Baidu...
19 by Ian Cutress on 2/6/2018
SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs
SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...
9 by Anton Shilov on 2/6/2018
Honor Launches The Honor 9 Lite
Today Honor officially launches the Honor 9 Lite for western markets. The launch follows that of the Honor 7X and V10 last month which were the company’s first models...
19 by Andrei Frumusanu on 2/6/2018
Honor Launches Red 7X For The US
Part of a minor announcement, Honor has launched a limited edition red version of the Honor 7X. The Honor 7X is an entry level smartphone sporting a 5.93” 18:9...
151 by Andrei Frumusanu on 2/6/2018
AMD Releases Radeon Software Adrenalin Edition 18.2.1
Last week, AMD released Radeon Software Adrenalin Edition 18.2.1, a more minor bugfix-oriented driver update. 18.2.1 also brings support for Final Fantasy XII: The Zodiac Age, a remastered version...
5 by Nate Oh on 2/5/2018
HP Z4 Workstations Get Xeon W and Core X, 18-Core
Today, HP has released information on the update to its Z4 workstation line. The Z4 workstation is now available with both Xeon W and Core-X based processors for the...
20 by Joe Shields on 2/5/2018
HP Windows Mixed Reality Headset, Professional Edition, Coming March
HP has added a second Windows Mixed Reality headset to its lineup, this one being dubbed the 'Professional Edition'. This headset, according to HP, is geared more towards a...
12 by Joe Shields on 2/5/2018
ATP Launches M.2 NVMe SSDs: 3D MLC, SMI, Extreme Temps, Up to 2.5 GB/s
ATP has introduced its new lineup of SSDs aimed at industrial applications and are designed to withstand harsh environmental conditions, such as extreme temperatures and humidity. The new ATP...
9 by Anton Shilov on 2/2/2018
Intel Appoints New CTO, Confirms Establishment of Product Assurance & Security Group
Intel this week named Michael Mayberry its new Chief Technology Officer effective immediately. The new CTO will be responsible for Intel’s global research and technology development efforts. In addition...
19 by Anton Shilov on 2/2/2018
Azio Ships Retro Classic Bluetooth Keyboard: Expensive Luxury for Windows & Mac
Azio has started to sell wireless versions of its old-fashioned typewriter-like Retro Classic mechanical keyboard. The devices look the same as their wired brethren and are available in four...
8 by Anton Shilov on 2/2/2018
Apple Announces Q1 FY 2018 Earnings
This afternoon Apple announced their earnings, and for the quarter, they had record revenues of $88.293 billion, which is up 13% from the same quarter a year ago. Margins...
13 by Brett Howse on 2/1/2018
Skylake-D Creeps Out on Intel’s Price List
News about the next update on Intel’s Xeon-D line has been thin. For over a year now, we were expecting to hear what plans were in store for one...
28 by Ian Cutress on 2/1/2018
Plextor Launches M8V SATA SSD
Plextor has introduced the M8V series, their latest budget SATA SSDs, now with 64-layer 3D TLC NAND. Plextor's budget SATA drives tends to use whatever controller and NAND combination...
10 by Billy Tallis on 2/1/2018
Microsoft Announces Q2 FY 2018 Earnings
This afternoon, Microsoft announced their earnings for the second quarter of their 2018 fiscal year. The company had revenues of $28.9 billion for the quarter, which is up 12%...
6 by Brett Howse on 1/31/2018
MSI Announces Immerse GH60 Gaming Headset, Vigor GK40 Keyboard and Vigor GK40 Combo
MSI this week has announced two new products to add to its gaming peripherals lineup: the Immerse GH60 Gaming Headset, as well as new Vigor GK40 keyboard. Along with...
6 by Joe Shields on 1/31/2018
TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020
TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...
27 by Anton Shilov on 1/31/2018
JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features
JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...
20 by Anton Shilov on 1/31/2018
AMD to Ramp up GPU Production, But RAM a Limiting Factor
One of the more tricky issues revolving around the GPU shortages of the past several months has been the matter of how to address the problem on the GPU...
34 by Ryan Smith on 1/31/2018
AMD Announces Q4 FY 2017 Results
This afternoon, AMD announced their earnings for the fourth quarter of 2017. AMD ended the 2017 fiscal year on a high note, with earnings that beat their initial estimates...
20 by Brett Howse on 1/30/2018
Samsung Launches Z-SSD SZ985: Up To 800GB Of Z-NAND
Samsung announced today that they are officially launching their first Z-SSD product, the SZ985. The Z-SSD uses Samsung's Z-NAND memory, a high-performance derivative of their 3D NAND flash memory...
45 by Billy Tallis on 1/29/2018
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