Samsung's New 512 GB UFS 3.0 Chip for Galaxy Fold, Now in Mass Production
Samsung this week said that it has begun mass production of its UFS 3.0 chips. The company’s initial lineup of UFS 3.0 products includes embedded drives featuring a 128...
6 by Anton Shilov on 2/27/2019
Lenovo's New 595-Gram Portable Display: The ThinkVision M14 USB-C Monitor
At the Mobile World Congress trade show, Lenovo has introduced a new portable display designed specifically for workers on the move. The ThinkVision M14 monitor matches design of the...
4 by Anton Shilov on 2/27/2019
Oppo Demonstrates 5G Smartphone at MWC 2019
One theme of the Mobile World Congress trade show is for companies to show off their future 5G products - or at least a prototype with a 5G sticker...
1 by Anton Shilov on 2/27/2019
The Sony Xperia 1: A Long 21:9 HDR 4K OLED Smartphone
Being a high-tech company with multiple divisions, Sony can fetch technologies from various units to build products with unique qualities. At Mobile World Congress 2019 the company introduced its...
20 by Anton Shilov on 2/27/2019
Micron Returns to the microSD Card Market with the Micron c200 Series: From 128 GB to 1 TB
About a year and a half after discontinuing its Lexar consumer storage business, Micron is making a comeback with a series of microSD cards that it's demonstrating at Mobile...
5 by Anton Shilov on 2/26/2019
GIGABYTE's W-3175X Motherboard Named: C621 Aorus Extreme
GIGABYTE has just lifted the lid on its latest entry into the workstation space with an extreme flavor: the GIGABYTE C621 Aorus Extreme. The new board is one of...
2 by Gavin Bonshor on 2/26/2019
USB 3.2 at 20 Gb/s Coming to High-End Desktops This Year
The USB 3.0 Promoters Group announced its USB 3.2 specification update that increases theoretical performance of a USB 3.2 interface over a Type-C cable to 20 Gbps back in...
62 by Anton Shilov on 2/26/2019
Micron and Western Digital Unveil 1 TB microSD Cards with A2
The evolution of 3D NAND memory had enabled storage device makers to offer rather unprecedented capacities. To that end, this week at Mobile World Congress, Micron and Western Digital...
18 by Anton Shilov on 2/26/2019
SK Hynix Details DDR5-6400
SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...
10 by Anton Shilov on 2/26/2019
Alcatel 3T 10 Launched: An Entry Level Android Tablet
Entry-level Android-based tablets are a relatively minor market, which is why companies offering such products tend to aim them at a specific geographical markets in a bid to avoid...
17 by Anton Shilov on 2/25/2019
BlackBerry Acquires Cylance, Gets AI & ML Security Technology
BlackBerry Limited has announced that it had completed acquisition of Cylance, a company developing machine learning and artificial intelligence-based security technology. The move adds valuable IP and technologies to...
22 by Anton Shilov on 2/25/2019
OnePlus 5G Prototype: Living Large
Here at Mobile World Congress, a number of companies are showing off 5G-enabled smartphones or prototypes. We've seen devices from most of the top smartphone global manufacturers, and despite...
7 by Anton Shilov on 2/25/2019
Nokia Launches Nokia 9 PureView at MWC 2019: So I Heard You Like Cameras
HMD Global has introduced its new Nokia flagship smartphone at MWC 2019. The key feature of the Nokia 9 PureView is its six-module camera (five lens + Time-of-Flight) co-designed...
32 by Anton Shilov on 2/25/2019
512 GB of UFS 3.0 Storage: Western Digital iNAND MC EU511
Western Digital said that it has now completed development and started sampling its first UFS 3.0 storage solutions for ‘5G era’ smartphones. The new embedded flash drives (EFDs) provide...
6 by Anton Shilov on 2/25/2019
Nubia at MWC 2019: Wearable OLED Smartphone Coming to a Wrist Near You
Nubia, a division of ZTE, is prepping to release its first wearable watch-like smartphone. The device is currently being showcased at MWC in Barcelona, Spain, but the company is...
8 by Anton Shilov on 2/25/2019
Lenovo to Launch a Qualcomm Snapdragon 8cx Laptop with 5G
At Qualcomm’s press event today at Mobile World Congress, Lenovo representatives came on stage to confirm that the company will be building a new laptop using the Snapdragon 8cx...
9 by Ian Cutress on 2/25/2019
Qualcomm Launches the QCA6390 Chipset: 1.8 Gbps Wi-Fi 6 Ready with BlueTooth 5.1
With the upcoming ratification of the Wi-Fi 6 (802.11ax) standard expected in August, a number of companies are gearing up with Wi-Fi 6 ‘ready’ routers and end-points to get...
9 by Ian Cutress on 2/25/2019-page-008_carousel.jpg)
Intel and Fibocom to Co-Develop a 5G M.2 Module for System Integration
Fibocom Wireless is a company that has won investment from Intel Capital and develops wireless modules as well as communication solutions. As part of the Mobile World Congress event...
1 by Ian Cutress on 2/25/2019-page-006_carousel.jpg)
Intel Reveals Name of Next Generation Xeon D: Hewitt Lake
The Xeon D processor line for Intel has been a combination networking/microserver processor that increased significantly in core count, power, and capability in the previous generation. We now have...
11 by Ian Cutress on 2/25/2019
Alcatel Launches 3L at MWC 2019: A 5.94-Inch Smartphone at €139
Alcatel introduced its new entry-level smartphone that is equipped with a 5.9-inch display, a quad-core Qualcomm SoC, 16 GB of NAND storage, facial recognition, and a dual camera, a...
2 by Anton Shilov on 2/25/2019
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