Samsung to End B-Die DDR4: The Overclockers' Favorite
For many years leading DRAM module manufacturers have used Samsung’s B-die 8 Gb memory chips for their fastest and most advanced DIMMs. This quarter Samsung intends to discontinue production...
16 by Anton Shilov on 5/14/2019
Lenovo Unveils ThinkPad X1 Extreme Gen 2: New CPU, GPU, OLED Display Option
Lenovo has introduced its second-generation ThinkPad X1 Extreme laptop for performance demanding professionals. It comes equipped with a faster CPU and GPU when compared to the current generation 15.6-inch...
16 by Anton Shilov on 5/14/2019
OnePlus Teases the OnePlus 7 Pro 5G: Seven Pro + 5G Later This Year
Alongside their new OnePlus 7 and OnePlus 7 Pro smartphones, OnePlus also used their UK event this afternoon to tease their first 5G-capable smartphone: the OnePlus 7 Pro 5G...
5 by Anton Shilov on 5/14/2019
AMD To Host “Next Horizon Gaming” Event & Product Unveil at E3 2019: June 10th, 3pm PT
After taking a break from the annual Electronic Entertainment Expo for a few years, AMD is going to be returning to one of their own haunts. This morning the...
15 by Ryan Smith on 5/14/2019
The Lenovo ThinkCentre Nano M90N: When Small Is Beautiful
People today want larger displays. Yet here comes a problem: the amount of space on the desk is finite, so there is a need for smaller desktop PCs and...
22 by Anton Shilov on 5/13/2019
Biostar Unveils Its X570 Racing GT8 Motherboard: PCIe Gen 4, DDR4-4000 and Triple M.2
It what seems to be an inadvertent move, Biostar has released information about its upcoming X570 Racing GT8 motherboard ahead of AMD's unveiling of the new X570 chipset. This...
40 by Gavin Bonshor on 5/13/2019
Intel Memory Plans: No New NAND Capacity, Wants to Move 3D XPoint Production to China
Like the rest of NAND flash industry, Intel is not particularly happy with oversupply on the market and decreasing prices. The company already said that it would reduce NAND...
29 by Anton Shilov on 5/13/2019
Cooler Master Launches the Compact SK621 Wireless Bluetooth Mechanical Keyboard
Back at CES 2019, Cooler Master unveiled three new and interesting wireless mechanical keyboards that would be launching later this year. Now the company is finally starting things off...
17 by Gavin Bonshor on 5/10/2019
SK Hynix Begins Sampling of 96-Layer 1 Tb 3D QLC NAND
SK Hynix recently started sampling of its 1 Tb 96-layer NAND flash memory devices featuring its PUC 3D QLC architecture. The new 1 Tb chip will enable SSD makers...
14 by Anton Shilov on 5/10/2019
AMD Releases Radeon Pro Software for Enterprise 19.Q2: Gaming Driver Support for Radeon Pro
AMD this week has released their Radeon Pro Software for Enterprise 19.Q2 WHQL, bringing support for the Windows 10 May 2019 Update due later this month, as well as...
13 by Nate Oh on 5/10/2019
Samsung EVO Plus microSDXC UHS-I 512GB Memory Card Capsule Review
As content capture devices are recording ever-higher bitrate videos and higher resolution photos, high capacity memory cards are increasingly in demand. Everything from smartphones to game consoles to PCs...
11 by Ganesh T S on 5/10/2019
Lenovo's ThinkPad X395: A 13.3-Inch AMD Ryzen Pro-Based Ultraportable
Long one of AMD's closest and most eager laptop partners, Lenovo has introduced one of the industry’s first Ryzen Pro 3000-powered ultra-portable premium business laptops. The ThinkPad X395 features...
55 by Anton Shilov on 5/9/2019
Corsair Releases The New Ironclaw RGB Wireless Gaming Mouse
Adding to their ever-growing range of PC gaming peripherals, Corsair has unveiled its Ironclaw RGB wireless gaming mouse. Similar to its predecessor, the Ironclaw RGB, the new wireless variant...
3 by Gavin Bonshor on 5/9/2019
SMART Modular Announces 32 GB SO-DIMMs for Extreme Environments
SMART Modular has introduced the industry’s first industrial-grade 32 GB DDR4 SO-DIMMs. The memory modules are aimed at ruggedized computing applications that require top-of-the-line capacity modules with improved reliability.
2 by Anton Shilov on 5/9/2019
Samsung Unveils 64 MP & 48 MP ISOCELL Bright Image Sensors for Smartphones
Samsung has introduced two new 0.8-μm image sensors for use in upcoming smartphones. The new sensors are the 48 MP ISOCELL Bright GM2 for advanced handsets as well as...
17 by Anton Shilov on 5/9/2019
Intel Xeon Update: Ice Lake and Cooper Lake Sampling, Faster Future Updates
Emerging workloads will require considerably higher performance, and in order to solve upcoming challenges Intel has adjusted its product roadmaps quite significantly. One of the key things that Intel...
29 by Anton Shilov on 5/9/2019
Behind The Scenes: SSD Testing In 2019 With Quarch's HD Power Module
Every so often we are asked for more behind-the-scenes information on how we test products. So now that we've completed some updates to our SSD testing workflow – thanks...
13 by Billy Tallis on 5/9/2019
Intel Process Technology Update: 10nm Server Products in 1H 2020, Accelerated 7nm in 2021
Intel provided an update regarding its upcoming fabrication technologies at its 2019 Investor Meeting. The company is on track to produce server-class products using its 10 nm manufacturing technology...
74 by Anton Shilov on 5/8/2019
SMART Modular HRS-T5E: A Ruggedized SATA SSD with AES-XTS 256
SMART Modular has introduced one of the industry’s first ruggedized SSDs based on 3D TLC NAND memory. Aimed at industrial and military customers, the high-reliability 2.5-inch SATA drive incorporates...
4 by Anton Shilov on 5/8/2019
Micron to Pay Intel $1.3B to $1.5B for IM Flash Stake
Earlier this year, Micron announced their intention to buy out Intel's stake of their memory technology joint venture, IM Flash Technologies. Now, as the process gets underway, Micron is...
26 by Anton Shilov on 5/8/2019
Facebook
Twitter
RSS